With EzloPi you can turn ESP boards into a Smart Boards with full Cloud and Mobile app capabilities with full Dashboard and Automation.

Any hardware developer can easily turn their devices to be a smart device with our Open source EzloPi.

Full Cloud support

Full Mobile App support

Full Dashboard capability

Open Source Firmware…

Its as simple as configure your GPIO press the button, now your device becomes smart by using any standard cheap boards available.

Hardware developers can now turn their devices to be smart devices at no cost!

Product Development
  1. Set up your device/hardware by visiting config.ezlopi.com/
Login to MiOS
  1. Log in using the credentials which you just set earlier while signing up.
Device Status
  1. Now click on Connect Device and a pop-up window will appear
Connection to Serial Port
  1. Now, select COM Port to which your ESP32 device is connected. In our case, the COM3 port is used.

Click Connect

EzloPi Status
  1. If you are new to this and it’s your first time configuring, select Create new Device ID. Enter Wifi SSID and Wifi Password.
  2. In the Device Configuration, tab click on One Wire.
Device Configuration
  1. A pop up window will open for inputting the following parameters.
  • Set a device name of your choosing. In our case we set it to DHT22
  • Set Out GPIO to 4.
  • Select The Device Subtype as the sensor you are choosing. In our case, we set it to DHT22.
  • Now Click the Apply button.
  • After clicking the apply button you can see a table of your setting in the device configuration tab. Press the Flash Device button.
EzloPi Device Status
  1. A window will appear on the bottom left side of the screen displaying “Please press BOOT button while flashing begins.
  2. Hold the BOOT button down until the next window appears on the bottom left side of the screen which says “Installation prepared. Please release the boot button now.
Flashing in Progress
  1. Release the BOOT button from your ESP32 when this pop-up on the bottom right window appears.
Connect to Serial Port
  1. After some time this popup will appear saying Device Flashed Successfully! This means that your device has been set up successfully.
Ezlo_EP01 is a low-power embedded Wi-Fi and Bluetooth module that Ezlo has developed. It consists of a highly integrated chip (ESP32-D0WDQ6), a few peripherals, an embedded Wi-Fi network protocol stack, the Bluetooth LE network protocol, and varied library functions
The Ezlo_EP01 is a versatile Wi-Fi+Bluetooth®+Bluetooth LE MCU designed for a wide range of applications, from low-power networked sensors to the most challenging tasks such as voice encoding, music streaming and MP3 decoding. This module is based on the ESP32-D0WDQ6* chip. The embedded chip is designed to scale and adapt.
CPU and OnChip MemoryCrystalOscillators Themoduleusesa40-MHzcrystaloscillator
ESP32-U4WDH embedded, Xtensa dual-coreWi-Fi
32-bit LX6 microprocessor, up to 240 MHz802.11b/g/n
448 KB ROMBit rate: 802.11n up to 150 Mbps
520 KB SRAMA-MPDU and A-MSDU aggregation
16 KB SRAM in RTC0.4 µs guard interval support
128M-BIT SPI flashCenter frequency range of operating channel:
2412 ~ 2484 MHz
Operating ConditionsBluetooth
Bluetooth v4.2 BR/EDR and Bluetooth LE
Operating voltage/Power supply: 3.0 ~ 3.6 Vspecification
Operating ambient temperature:Class-1, class-2, and class-3 transmitter
– 85 °C version module: –40 ~ 85 °CAFH
– 105 °C version module: –40 ~ 105 °CCVSD and SBC
Antenna Options
ESP32: On-board PCB antenna
2. Module interfaces
2.1 Dimensions and footprint
Ezlo_EP01 has two rows of pins with a 2 ±0.1 mm pin spacing. The Ezlo_EP01 dimensions are 16 mm (W)×24 mm (L) ×1.2 mm (H). The diagram of dimensions Module Interface
2.2 Pin definition
1 – Gpio21(ADC AI)
2 – En(I – Enabling pin, which needs to be connected to the voltage of 3.3V in normal cases and corresponds to CHIP_EN)
3 – Gpio25(I/O – Common IO pin)
4 – Gpio26(P – Support hardware PWM)
5 – Gpio27(I/O – Support hardware PWM and Common IO pin)
6 – Gpio16(I/O – Support hardware PWM and Common IO pin)
7 – Power+3,3V(P – Power supply source (3.3V))
8 – Gnd(P – Power supply reference ground)
9 – Gpio19(O – Common IO pin)
10 – Gpio22(O – Common IO pin)
11 – Gpio4(I/O – Common IO pin)
12 – Gpio17( I/O – Support hardware PWM and Common IO pin)
13 – Gpio23( I/O – Support hardware PWM and Common IO pin)
14 – Rx1(I/O – UART0_RXD)
15 – Tx1(I/O – UART0_TXD)
3. Electrical parameters
3.1 Absolute Maximum Ratings
VDDA, VDD3P3, VDD3P3_RTC, VDD3P3_CPU, VDD_SDIOAllowed input voltage–0.33.6V
IoutputCumulative IO output current(1)1200mA
TSTOREStorage temperature–40150°C

*The product proved to be fully functional after all its IO pins were pulled high while being connected to ground for 24 consecutive hours at ambient temperature of 25 °C.

Recommended Power Supply Characteristics

VDDA, VDD3P3_RTC , VDD3P3, VDD_SDIO (3.3 V mode)Voltage applied to power supply pins per power domain2.3/
VDD3P3_CPUVoltage applied to power supply pin1.
IVDDCurrent delivered by external power supply0.5A
TOperating temperature–40125°C
3.2 DC Characteristics (3.3 V, 25 °C)
CINPin capacitance2pF
VIHHigh-level input voltage0.75×VDDVDD+0.3V
VILLow-level input voltage–0.30.25×VDDV
IIHHigh-level input current50nA
IILLow-level input current50nA
VOHHigh-level output voltageV
VOLLow-level output voltage0.1×VDDV
High-level source currentVDD3P3_CPU power domain
(VDD1 = 3.3 V, VOH >= 2.64 VVDD3P3_RTC power domain
output drive strength set to the maximum)VDD_SDIO power omain
IOLLow-level sink current (VDD1= 3.3 V, VOL = 0.495 V, output drive strength set to the maximum28mA
RPUResistance of internal pull-up resistor45VkΩ
RPDResistance of internal pull-down resistor45VkΩ
VIL_nRSLow-level input voltage of CHIP_ PU to shut down the chip0.6V
3.3 RF Current Consumption in Active Mode Current Consumption Depending on RF Modes
Work ModeMinTypMaxUnit
Transmit 802.11b, DSSS 1 Mbps, POUT = +19.5 dBm240mA
Transmit 802.11g, OFDM 54 Mbps, POUT = +16 dBm190mA
Transmit 802.11n, OFDM MCS7, POUT = +14 dBm180mA
Receive 802.11b/g/n95 ~ 100mA
Transmit BT/BLE, POUT = 0 dBm130mA
Receive BT/BLE95 ~ 100mA
3.4 Wi-Fi Radio Characteristics
Operating frequency range24122484MHz
Output impedance30+j10Ω
TX power
11n, MCS7
11b mode
11b, 1 Mbps
11b, 11 Mbps
11g, 6 Mbps
11g, 54 Mbps
11n, HT20, MCS0
11n, HT20, MCS7
11n, HT40, MCS0
11n, HT40, MCS7
Adjacent channel rejection
11g, 6 Mbps
11g, 54 Mbps
11n, HT20, MCS0
11n, HT20, MCS7
4. Antenna
4.1 Antenna type
Ezlo_EP01 uses only an onboard PCB antenna.
4.2 Antenna interference reduction
To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To ensure antenna performance, the PCB should not be routed or clad with copper in the antenna area. The main points of the layout: Make sure that there is no substrate medium directly below or above the printed antenna. Make sure that the area around the printed antenna is far away from the metal copper skin, so as to ensure the radiation effect of the antenna to the greatest extent Antenna
5 Recommended PCB layout
PCP Layout
6 Power-on sequence and resetting
6.1 Treatment of GPIO pins
A few pins of the module will have instantaneous high-level pulses before the chip fully works, and everything will be normal after the chip works. For these pins, if they are directly used as driving light sources or relays, in order to avoid the effect of burrs at the moment of power-on, refer to the following processing methods: Pull down a 1-KΩ resistor at an output port of a pin, and then connect a diode in series. At this time, the voltage of a GPIO will drop to about 2.7V after passing through the diode. The red box represents the original drive tube on the customer’s baseboard. A diode D1 and pull-down 1-KΩ resistor need to be added. If a lamp is directly driven, pull down a 10-KΩ resistor on the grid of the positive Mos. If a lamp is not directly driven and a PWM signal will not be sent until the module is officially launched, there is no need to add a pull-down resistor and diode. If a relay is driven, you can change the diode to a resistor of 0 Ω according to the actual situation.
6.2 Storage Conditions
The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric environment of ∠ 40 °C and 90%RH. The module is rated at the moisture sensitivity level (MSL) of 3. After unpacking, the module must be soldered within 168 hours with the factory conditions 25 ± 5 °C and 60 %RH. If the above conditions are not met, the module needs to be baked.
6.3 Electrostatic Discharge (ESD)
  • Human body model (HBM): ±2000 V
  • Charged-device model (CDM): ±500 V
6.4 Reflow Profile
Solder the module in a single reflow Temperature Graph
6.5 Ultrasonic Vibration
Avoid exposing Ezlo_EP01 modules to vibration from ultrasonic equipment, such as ultrasonic welders or ultrasonic cleaners. This vibration may induce resonance in the in-module crystal and lead to its malfunction or even failure. As a consequence, the module may stop working or its performance may deteriorate