EPI D01 – ESP Wifi/BLE module

Hardware model: Ezlo_EP01
Protocol: Wi-Fi and Bluetooth
Chip platform: ESP32-D0WDQ6
Sample price:Free


Ezlo_EP01 is a low-power embedded Wi-Fi and Bluetooth module that Ezlo has developed. It consists of a highly integrated chip (ESP32-D0WDQ6), a number of peripherals, an embedded Wi-Fi network protocol stack, the Bluetooth LE network protocol, and varied library functions.

1. Scope of application

The Ezlo_EP01 is a versatile Wi-Fi + Bluetooth® + Bluetooth LE MCU designed for a wide range of applications, from low-power networked sensors to the most challenging tasks such as voice encoding, music streaming and MP3 decoding. This module is based on the ESP32-D0WDQ6* chip. The embedded chip is designed to scale and adapt. The module consists of a ESP32-U4WDH embedded chip with a 32-bit LX6 microprocessor with 448KB ROM, 520 KB SRAM and 16KB SRAM in RTC. It also has a 128 MBit SPI flash, built-in Wi-Fi 802.11b/g/n network protocol along with Bluetooth v4.2 BR/EDR and Bluetooth LE. The central frequency ranges from 2412 ~ 2484 MHz. The operating voltage/Power supply is 3.0 ~ 3.6 V with Operating ambient temperature of –40 ~ 85 °C for – 85 °C version module and –40 ~ 105 °C for – 105 °C version module. The module comes with an onboard PCB antenna.

2. Module interfaces

2.1 Dimensions and footprint

Ezlo_EP01 has two rows of pins with a 2 ± 0.1 mm pin spacing. The Ezlo_EP01 dimensions are 16 mm (W) × 24 mm (L) × 1.2 mm (H).

Module Interface

2.2 Pin definition

Pin 2EN(I – Enabling pin, which needs to be connected to the voltage of 3.3V in normal cases and corresponds to CHIP_EN)
Pin 3GPIO25(I/O – Common IO pin)
Pin 4GPIO26(P – Support hardware PWM)
Pin 5GPIO27(I/O – Support hardware PWM and Common IO pin)
Pin 6GPIO16(I/O – Support hardware PWM and Common IO pin)
Pin 7Power +3.3V(P – Power supply source (3.3V))
Pin 8GND(P – Power supply reference ground)
Pin 9GPIO19(O – Common IO pin)
Pin 10GPIO22(O – Common IO pin)
Pin 11GPIO4(I/O – Common IO pin)
Pin 12GPIO17(I/O – Support hardware PWM and Common IO pin)
Pin 13GPIO23(I/O – Support hardware PWM and Common IO pin)
Pin 14Rx1(I/O – UART0_RXD)
Pin 15Tx1(I/O – UART0_TXD)

3. Electrical parameters

3.1 Absolute Maximum Ratings

VDDA, VDD3P3, VDD3P3_RTC, VDD3P3_CPU, VDD_SDIOAllowed input voltage–0.33.6V
IoutputCumulative IO output current (1)1200mA
TSTOREStorage temperature–40150°C

*The product proved to be fully functional after all its IO pins were pulled high while being connected to ground for 24 consecutive hours at ambient temperature of 25 °C

3.2 Absolute Maximum Ratings

VDDA, VDD3P3_RTC, VDD3P3, VDD_SDIO (3.3 V mode)Voltage applied to power supply pins per power domain2.3/
VDD3P3_CPUVoltage applied to power supply pin1.83.33.6V
IVDDCurrent delivered by external power supply0.5A
TOperating temperature–40125°C

3.3 DC Characteristics (3.3 V, 25 °C)

CINPin capacitance2pF
VIHHigh-level input voltage0.75×VDDVDD+0.3V
VILLow-level input voltage–0.30.25×VDDV
IIHHigh-level input current50nA
IILLow-level input current50nA
VOHHigh-level output voltageV
VOLLow-level output voltage0.1×VDDV
IOHHigh-level source currentVDD3P3_CPU power domain40mA
(VDD1 = 3.3 V, VOH >= 2.64 VVDD3P3_RTC power domain40mA
output drive strength set to the maximumVDD_SDIO power domain20mA
IOLLow-level sink current (VDD1= 3.3 V, VOL = 0.495 V,28mA
RPUResistance of internal pull-up resistor45VkΩ
RPDResistance of internal pull-down resistor45VkΩ
VIL_nRSLow-level input voltage of CHIP_ PU to shut down the chip0.6V

3.4 RF Current Consumption in Active Mode Current Consumption Depending on RF Modes

Work ModeMinTypMaxUnit
Transmit 802.11b, DSSS 1 Mbps, POUT = +19.5 dBm240mA
Transmit 802.11g, OFDM 54 Mbps, POUT = +16 dBm190mA
Transmit 802.11n, OFDM MCS7, POUT = +14 dBm180mA
Receive 802.11b/g/n —95 ~ 100mA
Transmit BT/BLE, POUT = 0 dBm130mA
Receive BT/BLE95 ~ 100mA

3.5 Wi-Fi Radio Characteristics

Operating frequency range24122484MHz
Output impedance30+j10Ω
TX power11n, MCS7121314dBm
11b mode18.519.520.5dBm
Sensitivity11b, 1 Mbps–98dBm
11b, 11 Mbps–88dBm
11g, 6 Mbps–93dBm
11g, 54 Mbps–75dBm
11n, HT20, MCS0–93dBm
11n, HT20, MCS7–73dBm
11n, HT40, MCS0–90dBm
11n, HT40, MCS7–70dBm
Adjacent channel rejection11g, 6 Mbps27dBm
11g, 54 Mbps13dBm
11n, HT20, MCS027dBm
11n, HT20, MCS712dBm

4. Antenna

4.1 Antenna type

Ezlo_EP01 uses only an onboard PCB antenna.

4.2 Antenna interference reduction

To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts.

To ensure antenna performance, the PCB should not be routed or clad with copper in the antenna area. The main points of the layout: Make sure that there is no substrate medium directly below or above the printed antenna.

Make sure that the area around the printed antenna is far away from the metal copper skin, so as to ensure the radiation effect of the antenna to the greatest extent.

Antenna interference reduction

5. Recommended PCB layout

Recommended PCB layout

6. Power-on sequence and resetting

6.1 Treatment of GPIO pins

A few pins of the module will have instantaneous high-level pulses before the chip fully works, and everything will be normal after the chip works. For these pins, if they are directly used as driving light sources or relays, in order to avoid the effect of burrs at the moment of power-on, refer to the following processing methods: Pull down a 1-KΩ resistor at an output port of a pin, and then connect a diode in series.

At this time, the voltage of a GPIO will drop to about 2.7V after passing through the diode. The red box represents the original drive tube on the customer’s baseboard. A diode D1 and pull-down 1-KΩ resistor need to be added. If a lamp is directly driven, pull down a 10-KΩ resistor on the grid of the positive Mos. If a lamp is not directly driven and a PWM signal will not be sent until the module is officially launched, there is no need to add a pull-down resistor and diode. If a relay is driven, you can change the diode to a resistor of 0 Ω according to the actual situation.

6.2 Storage Conditions

The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric environment of ∠ 40 °C and 90%RH. The module is rated at the moisture sensitivity level (MSL) of 3. After unpacking, the module must be soldered within 168 hours with the factory conditions 25 ± 5 °C and 60 %RH. If the above conditions are not met, the module needs to be baked.

6.3 Electrostatic Discharge (ESD)

  • Human body model (HBM): ±2000 V
  • Charged-device model (CDM): ±500 V

6.4 Reflow Profile

Solder the module in a single reflow.

Reflow Profile

6.5 Ultrasonic Vibration

Avoid exposing Ezlo_EP01 modules to vibration from ultrasonic equipment, such as ultrasonic welders or ultrasonic cleaners. This vibration may induce resonance in the in-module crystal and lead to its malfunction or even failure. As a consequence, the module may stop working or its performance may deteriorate.

Technical documentation


Design & Development

Application fields

Application Examples

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